Our HTRB (High Temperature Reverse Bias) Chamber is designed for long-duration reliability testing of semiconductor devices under elevated temperature and reverse-bias electrical stress.
HTRB testing is widely used to evaluate the reliability of power semiconductors, including Si, SiC and GaN devices, by accelerating potential degradation mechanisms such as increased leakage current, junction degradation and electrical instability.
We provide HTRB chambers that can be configured to suit different DUT quantities, temperature requirements, electrical feedthroughs, test fixtures and monitoring systems.
The chamber provides a stable and uniform high-temperature environment for extended HTRB testing. Optimized air circulation helps maintain consistent temperature conditions across the DUT test area.
Multiple semiconductor devices can be tested simultaneously using customized racks and fixtures.
The internal configuration can be designed according to the required:
Electrical feedthroughs can be configured to connect the DUT fixtures with external DC power supplies and monitoring equipment.
This allows the environmental chamber to be integrated with the customer’s existing HTRB test system or supplied as part of a complete test solution.
Temperature and test conditions can be continuously monitored throughout the test.
Optional data acquisition and monitoring systems can provide:
The HTRB system can incorporate multiple protection functions for long-duration testing, including:
An HTRB test system typically consists of:
Temperature Chamber + DUT Fixture + DC Power Supply + Electrical Feedthrough + Monitoring & Data Acquisition
We can support the complete system, including chamber selection, customized DUT fixtures, electrical integration, temperature monitoring and test automation.
| Parameter | Specification |
| Application | HTRB / Semiconductor Reliability Testing |
| Temperature Range | Up to +200°C, depending on configuration |
| Temperature Control | Digital PID control |
| Temperature Uniformity | Application dependent |
| Working Volume | Customized |
| DUT Capacity | Customized |
| Electrical Feedthrough | Available |
| DUT Fixture | Customized |
| Temperature Monitoring | Available |
| Data Logging | Available |
| Remote Monitoring | Optional |
| DC Power Supply Integration | Optional |
| Test Automation | Optional |
| Safety Protection | Standard / Customized |
Final specifications are selected according to the DUT, test temperature, bias voltage, test duration, DUT quantity and applicable test specification.
The HTRB chamber can be configured for semiconductor reliability qualification requirements, including applicable methods under:
The actual HTRB test conditions should be defined according to the applicable device qualification standard and customer test specification.
We provides engineering support beyond the environmental chamber. We can help configure the chamber, DUT fixtures, electrical feedthroughs, monitoring, data acquisition and automation into a complete HTRB testing solution.
Whether you are qualifying Si, SiC or GaN power devices, we can develop a solution based on your required temperature, bias voltage, DUT quantity and test duration.
Contact us to discuss your HTRB testing requirements.